SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in Electronics Manufacturing Using Explainable Artificial Intelligence

Cite

Text

Gunraj et al. "SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in Electronics Manufacturing Using Explainable Artificial Intelligence." AAAI Conference on Artificial Intelligence, 2023. doi:10.1609/AAAI.V37I13.26858

Markdown

[Gunraj et al. "SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in Electronics Manufacturing Using Explainable Artificial Intelligence." AAAI Conference on Artificial Intelligence, 2023.](https://mlanthology.org/aaai/2023/gunraj2023aaai-soldernet/) doi:10.1609/AAAI.V37I13.26858

BibTeX

@inproceedings{gunraj2023aaai-soldernet,
  title     = {{SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in Electronics Manufacturing Using Explainable Artificial Intelligence}},
  author    = {Gunraj, Hayden and Guerrier, Paul and Fernandez, Sheldon and Wong, Alexander},
  booktitle = {AAAI Conference on Artificial Intelligence},
  year      = {2023},
  pages     = {15668-15674},
  doi       = {10.1609/AAAI.V37I13.26858},
  url       = {https://mlanthology.org/aaai/2023/gunraj2023aaai-soldernet/}
}