ML Anthology

Automated Inspection of Solder Bumps Using Visual Signatures of Specular Image-Highlights

Rajarshi Ray
CVPR 1989 pp. 588-596
doi:10.1109/CVPR.1989.37906 /cvpr/1989/ray1989cvpr-automated/
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Cite

Text

Ray. "Automated Inspection of Solder Bumps Using Visual Signatures of Specular Image-Highlights." IEEE/CVF Conference on Computer Vision and Pattern Recognition, 1989. doi:10.1109/CVPR.1989.37906

Markdown

[Ray. "Automated Inspection of Solder Bumps Using Visual Signatures of Specular Image-Highlights." IEEE/CVF Conference on Computer Vision and Pattern Recognition, 1989.](https://mlanthology.org/cvpr/1989/ray1989cvpr-automated/) doi:10.1109/CVPR.1989.37906

BibTeX

@inproceedings{ray1989cvpr-automated,
  title     = {{Automated Inspection of Solder Bumps Using Visual Signatures of Specular Image-Highlights}},
  author    = {Ray, Rajarshi},
  booktitle = {IEEE/CVF Conference on Computer Vision and Pattern Recognition},
  year      = {1989},
  pages     = {588-596},
  doi       = {10.1109/CVPR.1989.37906},
  url       = {https://mlanthology.org/cvpr/1989/ray1989cvpr-automated/}
}