ML Anthology

An Automatic Position Recognition Technique for LSI Assembly

Michihiro Mese, Takafumi Miyatake, Seiji Kashioka, Masakazu Ejiri, Isamu Yamazaki, Toshimitsu Hamada
IJCAI 1977 pp. 685-693
/ijcai/1977/mese1977ijcai-automatic/

Abstract

A fully automatic LSI wire-bonding system utilizing image processing techniques is described. The position recognition system developed is composed of measuring stations, a recognition device, a minicomputer, and cassette tape-recorders. The position of the bonding pad is found, generally in real-time, by the recognition device and computer. The computer calculates positional data of all bonding pads and stores them on a cassette tape for a subsequent wire-bonding process. The position recognition methods discussed are composed of a thresholding algorithm and a position-finding algorithm. These methods are evaluated from the viewpoint of thresholding stability, recognition rate and positional accuracy.

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Text

Mese et al. "An Automatic Position Recognition Technique for LSI Assembly." International Joint Conference on Artificial Intelligence, 1977.

Markdown

[Mese et al. "An Automatic Position Recognition Technique for LSI Assembly." International Joint Conference on Artificial Intelligence, 1977.](https://mlanthology.org/ijcai/1977/mese1977ijcai-automatic/)

BibTeX

@inproceedings{mese1977ijcai-automatic,
  title     = {{An Automatic Position Recognition Technique for LSI Assembly}},
  author    = {Mese, Michihiro and Miyatake, Takafumi and Kashioka, Seiji and Ejiri, Masakazu and Yamazaki, Isamu and Hamada, Toshimitsu},
  booktitle = {International Joint Conference on Artificial Intelligence},
  year      = {1977},
  pages     = {685-693},
  url       = {https://mlanthology.org/ijcai/1977/mese1977ijcai-automatic/}
}